As described previously, optical networks have advantage over electrical ones in speed and distance. However, optical networks are not perfect, they have costly components, increased installation times, and reliability concerns.

Different types of interaction of the optics on the board, provide different advantages. Chip integration on the board offers better memory functions and high-performance electrical logic. However, integrating board itself allows high-density electrical interfacing.

There are several developments happening that are done in order to increase state of integration while decreasing the cost. It can be achieved by soldering components on carrier substrate. Furthermore, amplifier and the electrical driver are stacked vertically on top of laser and photodiode array. It helps to overcome mechanical overhead.

Figure 1.

Definition of maximum optical signal is done with multimode polymer waveguides. The example of electro-optical integration can be seen from Figure 1. Substrate and laser are contacted electrically and optically. Mirror is used in the waveguiding structure in order to redirect the light. Integration of optical and copper technologies together in this example show density and capability increase.

Integrated optics implementation allows to achieve multiple optical function integration in one technology platform. Wavelength division multiplexing wouldn’t be possible without high-density electro-optical transceivers which offer enhanced functionality.

Packaging can be more compact and dense if the components are assembled directly into the system. It increases and closes proximity with router and chip.